Analysis of a Microchannel Interconnect Based on the Clustering of Smart-Pixel-Device Windows

Document Type

Article

Journal/Book Title/Conference

Applied Optics

Volume

35

Issue

8

Publisher

Optical Society of America

Publication Date

1996

First Page

1220

Last Page

1233

Abstract

A design analysis of a telecentric microchannel relay system developed for use with a smart-pixel-based photonic backplane is presented. The interconnect uses a clustered-window geometry in which optoelectronic device windows are grouped together about the axis of each microchannel. A Gaussian-beam propagation model is used to analyze the trade-off between window size, window density, transistor count per smart pixel, and lenslet ƒ-number for three cases of window clustering. The results of this analysis show that, with this approach, a window density of 4000 windows/cm2 is obtained for a window size of 30 µm and a device plane separation of 25 mm. In addition, an optical power model is developed to determine the nominal power requirements of a 32 × 32 smart-pixel array as a function of window size. The power requirements are obtained assuming a complementary metal-oxide semiconductor inverter-amplifier and dual-rail multiple-quantum-well self-electro-optic-effect devices as the receiver stage of the smart pixel.

Comments

Originally published by the Optical Society of America. Publisher's PDF available through remote link.

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