Document Type

Article

Journal/Book Title/Conference

Photonics Technology Letters

Volume

7

Issue

9

Publisher

IEEE

Publication Date

1995

First Page

1057

Last Page

1060

DOI

10.1109/68.414702

Abstract

We have demonstrated a representative portion of an optical backplane using FET-SEED smart pixels and free-space optics to interconnect printed circuit boards (PCB's) in a two board, unidirectional link configuration. 4×4 arrays of FET-SEED transceivers were designed, fabricated, and packaged all the PCB level, The optical interconnection was constructed using diffractive microoptics, and custom optomechanics. The system was operated in two modes, one showing high data throughput, 100 MBit/sec, and the other demonstrating large connection densities, 2222 channel/cm2.

Comments

Originally published by IEEE. Publisher's PDF can be accessed through Photonics Technology Letters.

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