Date of Award:
Master of Science (MS)
Mechanical and Aerospace Engineering
Ryan B. Berke
Nicholas A. Roberts
Tadd T. Truscott
Digital Image Correlation (DIC) is a technique which uses images taken before and after deformation to determine displacement and strain data over the surface of the sample. In order to obtain this data for both in-plane as well as out-of-plane direction, multiple views of the sample are required. Typically, this is accomplished using multiple cameras, but it is possible to use diffraction gratings to bend the light coming from the specimen in order to allow a single camera to capture multiple views. This technique is referred to as Diffraction Assisted Image Correlation (DAIC) and has been previously demonstrated at room temperature. This work expands this method for use at high temperatures by incorporating the use of ultraviolet (UV) lights for illumination and filtering out the light in the visible spectrum. This increases the temperature at which useful images can be captured by reducing the glow that specimens produce at elevated temperatures. When not filtered out, this glow saturates the camera sensor making DIC impossible. This new technique is referred to as Ultraviolet Diffraction Assisted Image Correlation (UV-DAIC).
Nickerson, Ethan K., "Ultraviolet Diffraction Assisted Image Correlation (UV-DAIC) for Single-Camera 3D Strain Measurement at Extreme Temperatures" (2018). All Graduate Theses and Dissertations. 7093.
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