Thermal management of sealed electronic enclosures using synthetic jet technology

Authors

Angela Minichiello, Utah State UniversityFollow
A. Glezer
J. G. Hartley
W. Z. Black

Document Type

Article

Journal/Book Title/Conference

Advances in Electronic Packaging, 1997: Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Converence

Volume

19

Issue

2

Publisher

American Society of Mechanical Engineers

Publication Date

1-1-1997

First Page

1809

Last Page

1812

Recommended Citation

Minichiello*, A., Glezer, A., Hartley, J. G., & Black, W. Z. (1997). Thermal management of sealed electronic enclosures using synthetic jet technology. Advances in Electronic Packaging, 1997: Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '97, EEP-Vol.19-2, pp. 1809-1812, New York, N.Y: American Society of Mechanical Engineers