Document Type

Conference Paper

Publication Date

2016

First Page

1

Last Page

15

Creative Commons License

Creative Commons Attribution-Noncommercial 4.0 License
This work is licensed under a Creative Commons Attribution-Noncommercial 4.0 License

Abstract

The Ionospheric Connection Explorer (ICON) satellite contains six science instruments that are integrated into a small volume on a single payload interface plate (PIP). Integrating these six instruments onto a single deck was challenging and complex in part due to their different physical configurations. After investigating various methods of reducing integration schedule and risk, an innovative approach of creating a high-fidelity full-scale mockup using 3D printed parts was chosen to address these concerns. This mockup included all instruments, the PIP, and associated harnessing, plumbing, and blanketing components. While the mockup integration effort yielded invaluable information for the flight payload integration, it was also used extensively throughout the payload integration to address issues as they arose, ultimately reducing the time, cost, and risk of the actual integration. This paper describes the design and construction of the mockup and its use to facilitate the ICON payload integration and test (I&T).

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