Electron Beam Lithography for Large Area Patterning 3: Data Conversion and Electron Beam Deflection Control

Authors

Susumu Hoshinouchi, Mitsubishi Electric Corporation
Hiroaki Tobuse, Mitsubishi Electric Corporation
Hidenobu Murakami, Mitsubishi Electric Corporation
Ryuichi Shimizu, Osaka University

Abstract

Electron beam direct writing technologies, specifically for the large area patterning of electronic devices such as printed wiring boards, are studied in this paper. The vector scanning method with two kinds of beam deflection, main-deflection and sub-deflection, has been adopted for the fabrication of circuit patterns of various line widths. The sub-deflection of high frequency oscillation is superimposed on the main-deflection, which allows for controlling each line width with ease. A data conversion and a deflection control system with several strategies have been developed to reduce the conversion time and the volume of output data. It is revealed that circuit patterns of widths from 70 μm to 250 μm can be fabricated effectively with these new technologies.

Recommended Citation

Hoshinouchi, Susumu; Tobuse, Hiroaki; Murakami, Hidenobu; and Shimizu, Ryuichi (1992) "Electron Beam Lithography for Large Area Patterning 3: Data Conversion and Electron Beam Deflection Control," Scanning Microscopy: Vol. 7: No. 1, Article 7.
Available at: https://digitalcommons.usu.edu/microscopy/vol7/iss1/7