Scanning Electron Microscopy


This paper surveys the application of transmission electron microscopy (TEM) to semiconductor materials and device technology. A broad spectrum of TEM studies requires the preparation of either plan-view or vertical sections; these sections are made using mechanical abrasion, chemical etching or ion milling or a combination of these procedures. A survey is then given of applications of TEM to four classes of studies of semiconductor materials and devices: the configuration of device features, crystallographic defects, lattice and atomic resolution imaging, and the analysis of phase and chemical composition.

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