Scanning Microscopy
Abstract
Scanning Auger microscopy is distinguished by its unique combination of surface selectivity, high spatial resolution, ease of identifying elements and quantifying composition, and ability to distinguish between chemical states. This paper describes several applications of scanning Auger microscopy, emphasizing the range of industrial research activities:
1. Electronic Materials. Contamination in an integrated circuit processing facility was identified and procedures for its removal determined. Causes for the delamination of printed circuit board foils were identified. Superlattice films were characterized and the deposition process evaluated.
2. Tribology. Analysis of surfaces in lubricated sliding contact revealed the effects of con tact kinematics and of molybdenum antifriction additives.
3. Corrosion. Early growth stages of phosphate coatings were found to be associated with a thin phosphate layer, not visible in SEM, interspersed with larger crystals. A corrosion layer on stainless steel/aluminum bimetal trim was shown to contain calcium carbonate and silicate deposits consistent with its galvanic protection mechanism.
4. Catalysis. Oxidation studies of Pd/ Rh alloys revealed varying surface compositions as a function of heat treatment temperature.
Several problems commonly encountered in Auger analysis are described and ways of minimizing or estimating their effects are discussed.
Recommended Citation
Chase, R. E. and Cole, G. S.
(1987)
"Industrial Applications of Auger Surface Analysis,"
Scanning Microscopy: Vol. 2:
No.
2, Article 8.
Available at:
https://digitalcommons.usu.edu/microscopy/vol2/iss2/8