Electron Beam Lithography for Large Area Patterning 4: Exposure of Resist on Internal Surface of a Through-Hole

Authors

Susumu Hoshinouchi, Mitsubishi Electric Corporation
Akio Yoshida, Mitsubishi Electric Corporation
Hidenobu Murakami, Mitsubishi Electric Corporation

Abstract

Electron beam direct writing technologies, specifically for the large area patterning of electronic devices such as printed wiring boards, are studied in this paper. The exposure characteristics of the resist on the internal surface of a through-hole are examined. A thick film resist which is composed mainly of unsaturated acrylic resins is prepared on the internal surface of the hole by an electrodeposition process.

It is proven that a 20 μm thick resist on the internal surface can be exposed efficiently by a 60 keV electron beam. This phenomenon becomes even stronger by placing a gold plated metal plate on the back of the substrate.

The comparison between the experiments and the Monte Carlo calculations for electron trajectory leads to a conclusion that the exposure characteristics of the resist on the internal surface of the through-hole can be explained mainly by the behavior of backscattered electron in the hole.

Recommended Citation

Hoshinouchi, Susumu; Yoshida, Akio; and Murakami, Hidenobu (1992) "Electron Beam Lithography for Large Area Patterning 4: Exposure of Resist on Internal Surface of a Through-Hole," Scanning Microscopy: Vol. 7: No. 1, Article 8.
Available at: https://digitalcommons.usu.edu/microscopy/vol7/iss1/8