Session

Technical Session III: Tidbits

Abstract

A multifunctional solar panel design is implemented as (i) carbon fiber composite panel and (ii) printed circuit board (PCB) for SwampSat, a University of Florida CubeSat. The solar panels structurally support SwampSat and accommodate embedded magnetic coils, a surface suitable for mounting solar cells, Sun sensor mounting and circuitry for sun sensors, solar cells, temperature sensors and magnetic coils. Wet layup technique, used for the development of carbon fiber composite panels with embedded magnetic coils and the vacuum bagging procedure to cure the panels are discussed. The implementation as a multi-layered PCB to accommodate 2oz per square foot copper traces as magnetic coils, copper deposits for mounting solar cells and circuitry and connectors for panel components is discussed. The paper discusses the design, development, lessons learned as well as the pros and cons of each implementation. Prototypes of fully functional panels are presented. Results of thermal-vacuum and vibration tests performed on the PCB panel are discussed.

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Aug 10th, 11:00 AM

Composite and PCB Based Implementations of a Solar Panel Design for SwampSat

A multifunctional solar panel design is implemented as (i) carbon fiber composite panel and (ii) printed circuit board (PCB) for SwampSat, a University of Florida CubeSat. The solar panels structurally support SwampSat and accommodate embedded magnetic coils, a surface suitable for mounting solar cells, Sun sensor mounting and circuitry for sun sensors, solar cells, temperature sensors and magnetic coils. Wet layup technique, used for the development of carbon fiber composite panels with embedded magnetic coils and the vacuum bagging procedure to cure the panels are discussed. The implementation as a multi-layered PCB to accommodate 2oz per square foot copper traces as magnetic coils, copper deposits for mounting solar cells and circuitry and connectors for panel components is discussed. The paper discusses the design, development, lessons learned as well as the pros and cons of each implementation. Prototypes of fully functional panels are presented. Results of thermal-vacuum and vibration tests performed on the PCB panel are discussed.