Date of Award:
12-2022
Document Type:
Thesis
Degree Name:
Master of Science (MS)
Department:
Electrical and Computer Engineering
Committee Chair(s)
Hongjie Wang
Committee
Hongjie Wang
Committee
Regan Zane
Committee
Nicholas A. Roberts
Abstract
This research investigates how heat transfer theory can be applied to evaluate the thermal performance of printed circuit board (PCB) designs. A model was developed for correlating theory to the physical parameters relating to the construction of the PCB and a computer application was developed to perform the thermal analysis. The application allows the importation of common PCB design files for a straightforward and quick analysis of a PCB design’s thermal performance. The application is open-source to allows for further development and free access from the public.
Checksum
ed0c681adb352e94c6f10aef7743e248
Recommended Citation
Ziegenfelder, Paul R., "Numerical Modeling and Simulating Thermal Performance of Printed Circuit Boards" (2022). All Graduate Theses and Dissertations, Spring 1920 to Summer 2023. 8620.
https://digitalcommons.usu.edu/etd/8620
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