Scanning electron acoustic microscopy (SEAM) and SEM infrared imaging (SEMIR) use both a modulated electron beam to generate thermal waves which produce acoustic waves detected by a transducer in the case of SEAM and affect the surface temperature which is directly monitored by the infrared emission. Both techniques are used to visualize non-adherence zones in III-V compounds devices. SEAM is applied to metallic layers like Au, Au-Ti, W-Mo-Ge deposited on a GaAs substrate. SEAM images are correlated with global adherence measurements.
SEMIR is applied to dielectric layers, like Si3N4/InP. An estimation of the surface temperature is given. Sensitivity and spatial resolution of both techniques are given and compared.
Bresse, J. F.
"Scanning Electron Acoustic Microscopy and Scanning Electron Microscopic Imaging of III-V Compounds Devices,"
Scanning Microscopy: Vol. 5
, Article 7.
Available at: https://digitalcommons.usu.edu/microscopy/vol5/iss4/7