Supplemental Material: Nanoscale Evidence for Temperature-Induced Transient Rheology and Post-Seismic Fault Healing
Description
Dataset for associated publication.
OCLC
1159982623
Document Type
Dataset
DCMI Type
Dataset
File Format
Publication Date
2020
Funder
NSF, Division of Earth Sciences (EAR)
Publisher
GSA
Award Number
NSF, Division of Earth Sciences (EAR) 1654628
Award Title
CAREER: Thermochronometric and textural signatures of fault damage zones and stimulating middle school student interest in earthquake science
Methodology
See dataset.
Referenced by
Ault, A.K., Jensen, J.L., McDermott, R.G., Shen, F.-A., & Van Devener, B.R. (2019). Nanoscale evidence for temperature-induced transient rheology and postseismic fault healing. Geology, 47(12), 1203-1207. doi:10.1130/G46317.1
Language
eng
Disciplines
Geology
License
This work is licensed under a Creative Commons Attribution 4.0 License.
Identifier
https://doi.org/10.1130/2020003
Recommended Citation
Ault, A.K., Jensen, J.L., McDermott, R.G., Shen, F.-A., & van Devener, B.R. (2020). Supplemental Material: Nanoscale Evidence for Temperature-Induced Transient Rheology and Postseismic Fault Healing. GSA. https://doi.org/10.1130/2020003