Effect of resin particle size on waferboard adhesive efficiency

Authors

S. Ellis

Document Type

Article

Journal/Book Title/Conference

Wood and Fiber Science

Volume

25

Issue

3

First Page

214

Last Page

219

Publication Date

1993

Recommended Citation

Ellis, S. 1993. Effect of resin particle size on waferboard adhesive efficiency. Wood and Fiber Science 25 (3): 214-219.