Aspen Bibliography

Influence of ACA and CCA waterborne preservatives on the properties of aspen waferboard

Document Type

Article

Journal/Book Title/Conference

Forest Products Journal

Volume

32

Issue

3

First Page

22

Last Page

26

Publication Date

1982

Abstract

Aspen waferboards of 41 pcf nominal density were manufactured from untreated aspen wafers and wafers treated with 0.2 and 0.4 pcf ammoniacal copper arsenite (ACA) and chromated copper arsenate (CCA) using 2.5 percent powdered novolac or resole phenolformaldehyde resins and 1 percent wax. All resin- preservative combinations exceeded the minimum requirements of ANSI A208.1-1979 for modulus of rupture (MOR), modulus of elasticity (MOE), and bonding system durability of grade 2-MW particleboards; only the MORs of the resole-CCA boards were reduced by preservative treatment. When compared to the untreated, all preservative-treatments reduced internal bond (IB) and three of the four CCA board types did not meet the grade 2-MW minimum IB requirement. Overall, ACA was not as degradative as CCA and except for a modest IB reduction, the ACA-treated panels generally performed as well as the untreated, both before and after accelerated aging. Preservative concentration had little effect on board properties except that resole-ACA 0.4 was better than resole-ACA 0.2. Overall, the two preservatives were more compatible with the novolac than with the resole. The most favorable preservative-resin combination appeared to be ACA with a novolac resin or possibly a resole.

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