Session
Technical Session VII: Instruments & Sensors
Abstract
Until recently, miniaturization of RF remote sensing instruments has not been cost effective. Aperture size has governed launch vehicle selection and spacecraft mass has been well within margins. However, as technologies improve for miniature spacecraft, multiple spacecraft can fit within small launch vehicle shrouds. Down-sizing payloads is now advantageous. E-Systems is applying state-of the- art technologies to significantly reduce the size and weight of RF remote sensing payload electronics. Current activities include the development of MMIC modules; the application of advanced, materials; the development of multiband feeds; and the development of micromachined filters and other RF components. These technologies will be combined with Multi-chip Modules (MCMs) and application specific integrated circuits (ASICs) to yield a new generation of instruments. Further miniaturization is planned using emerging mixed-mode technologies that will allow these MMICs and MCMs to be combined onto common substrates, and new high-efficiency solid state power amplifiers to replace the current traveling wave tube amplifiers (TWTAs) in active sensors. With these advances, it becomes feasible to integrate the RF components with the feed and mount the sensor electronics virtually on the back of the antenna, thereby reducing cabling losses and permitting integrated testing and acceptance of the electronics and antenna as a complete system before integration on the spacecraft. This reduces cost, complexity, and facilities required for integrating small spacecraft missions.
Miniaturized RF Remote Sensing Instruments
Until recently, miniaturization of RF remote sensing instruments has not been cost effective. Aperture size has governed launch vehicle selection and spacecraft mass has been well within margins. However, as technologies improve for miniature spacecraft, multiple spacecraft can fit within small launch vehicle shrouds. Down-sizing payloads is now advantageous. E-Systems is applying state-of the- art technologies to significantly reduce the size and weight of RF remote sensing payload electronics. Current activities include the development of MMIC modules; the application of advanced, materials; the development of multiband feeds; and the development of micromachined filters and other RF components. These technologies will be combined with Multi-chip Modules (MCMs) and application specific integrated circuits (ASICs) to yield a new generation of instruments. Further miniaturization is planned using emerging mixed-mode technologies that will allow these MMICs and MCMs to be combined onto common substrates, and new high-efficiency solid state power amplifiers to replace the current traveling wave tube amplifiers (TWTAs) in active sensors. With these advances, it becomes feasible to integrate the RF components with the feed and mount the sensor electronics virtually on the back of the antenna, thereby reducing cabling losses and permitting integrated testing and acceptance of the electronics and antenna as a complete system before integration on the spacecraft. This reduces cost, complexity, and facilities required for integrating small spacecraft missions.
