Session
Technical Session III: Advanced Sensor Concepts
Abstract
The application of high performance low cost linear arrays of thermal detectors for use in small spacecraft is now becoming possible due to the availability of MEMS (Micro Electronic Machined Structures) technology. Large pixel count devices are now practical and affordable. MEMS based thermal sensors allow integration of the focal plane, electronics and optics within the sensor package paving the way for smaller, more affordable and better performing payload instruments such as hyperspectral radiometers, cloud mappers, as well as attitude sensors such as Earth sensors and horizon crossing indicators. Prior to the use of MEMS technology, arrays of thermal detectors were difficult and expensive to produce and required larger geometry, pixel spacing and fill factors. MEMS produces higher performance devices (D*), reduced crosstalk between pixels and better thermal management. Several new sensor designs have been developed and produced using MEMS technology. The improvements in cost and performance are discussed as well as new designs which are appropriate for use in payload instruments.
MEMS Technology Based Sensors for Payload Instruments and Attitude Control for Small Satellites
The application of high performance low cost linear arrays of thermal detectors for use in small spacecraft is now becoming possible due to the availability of MEMS (Micro Electronic Machined Structures) technology. Large pixel count devices are now practical and affordable. MEMS based thermal sensors allow integration of the focal plane, electronics and optics within the sensor package paving the way for smaller, more affordable and better performing payload instruments such as hyperspectral radiometers, cloud mappers, as well as attitude sensors such as Earth sensors and horizon crossing indicators. Prior to the use of MEMS technology, arrays of thermal detectors were difficult and expensive to produce and required larger geometry, pixel spacing and fill factors. MEMS produces higher performance devices (D*), reduced crosstalk between pixels and better thermal management. Several new sensor designs have been developed and produced using MEMS technology. The improvements in cost and performance are discussed as well as new designs which are appropriate for use in payload instruments.
