Session
Poster Session 2
Abstract
The size and mass constraints on small satellites provide a serious challenge for ecient heat dissipation from electronics. Incorporating thermal straps, or more sophisticated hardware, can put serious strain on mass budgets, if the placement of such devices is even feasible in the form factor of the satellite. The ability to use existing structures in small satellites, such as payload housings, can be an attractive alternative to provide thermal mass for integrated electronics. With appropriate materials and surface treatment, using an existing payload housing is shown to be a viable solution to dissipating heat from high-power components. This manuscript uses simulations to describe appropriate measures for eective heat removal from a high performance, space-based computational unit.
Thermal Management and Design of High Heat Small Satellite Payloads
The size and mass constraints on small satellites provide a serious challenge for ecient heat dissipation from electronics. Incorporating thermal straps, or more sophisticated hardware, can put serious strain on mass budgets, if the placement of such devices is even feasible in the form factor of the satellite. The ability to use existing structures in small satellites, such as payload housings, can be an attractive alternative to provide thermal mass for integrated electronics. With appropriate materials and surface treatment, using an existing payload housing is shown to be a viable solution to dissipating heat from high-power components. This manuscript uses simulations to describe appropriate measures for eective heat removal from a high performance, space-based computational unit.
