Session
Swifty Session 7: Instrumentation
Location
Utah State University, Logan, UT
Abstract
Taking advantage of technological developments in wafer-scale processing over the past two decades, such as deep etching, 3-D chip stacking, and double-sided lithography, we have designed, fabricated, and tested the key elements of an ultracompact (1.7cm-x 1.4cm x 1.4cm) plasma spectrometer that requires only low-voltage power supplies, has no microchannel plates, and has a high aperture area to instrument volume ratio. The energy analyzer and collimator components of the instrument are integrated into a single lithographically fabricated layer to optimize alignment of the collimator and eliminate flux reduction penalties typically associated with collimators. We will present tests of the instrument that demonstrate energy analysis of 5 keV electrons with only 5.3 volts of bias and collimator defined angular resolutions that match the design goals of the instrument.
A Low-Voltage, Ultra-Compact Plasma Spectrometer for Small Spacecraft
Utah State University, Logan, UT
Taking advantage of technological developments in wafer-scale processing over the past two decades, such as deep etching, 3-D chip stacking, and double-sided lithography, we have designed, fabricated, and tested the key elements of an ultracompact (1.7cm-x 1.4cm x 1.4cm) plasma spectrometer that requires only low-voltage power supplies, has no microchannel plates, and has a high aperture area to instrument volume ratio. The energy analyzer and collimator components of the instrument are integrated into a single lithographically fabricated layer to optimize alignment of the collimator and eliminate flux reduction penalties typically associated with collimators. We will present tests of the instrument that demonstrate energy analysis of 5 keV electrons with only 5.3 volts of bias and collimator defined angular resolutions that match the design goals of the instrument.
