Session
Technical Poster Session 5
Location
Utah State University, Logan, UT
Abstract
3D PLUS has developed in the framework of its camera products development, and in collaboration with the Centre National d'Etudes Spatiales (CNES), an off-the-shelf highly miniaturized SWIR camera head for space applications. This opto-electronic module has been integrated using 3D PLUS packaging technology and electronics design expertise to design a product as compact and optimized as possible, suitable for wide range of space applications. This poster presents the development and manufacturing of 3D PLUS 3DCM830 SWIR Space Camera Head.
Highly Miniaturized SWIR Off-The-Shelf Camera Head for Space Applications
Utah State University, Logan, UT
3D PLUS has developed in the framework of its camera products development, and in collaboration with the Centre National d'Etudes Spatiales (CNES), an off-the-shelf highly miniaturized SWIR camera head for space applications. This opto-electronic module has been integrated using 3D PLUS packaging technology and electronics design expertise to design a product as compact and optimized as possible, suitable for wide range of space applications. This poster presents the development and manufacturing of 3D PLUS 3DCM830 SWIR Space Camera Head.
