Start Date
5-6-2019 10:15 AM
Description
Superhydrophobic surfaces possess desirable self-cleaning properties, but have also been shown to reduce heat transfer to subcooled water in impinging jet scenarios. Further investigation is required to explore the potential utility of such surfaces in high temperature applications such as rocket launch-pad cooling. Here, superheated silicon substrates with varying wettability are quenched by an impinging water jet, where the substrate temperature is above the boiling regime which has previously been unexplored. Silicon wafers are etched, coated, and integrated with an electric resistance heater and heated to temperatures up to 300 ° C before being quenched by an axisymmetric water jet. The early results of this study confirm previous conjecture that decreased surface wettability is correlated to decreased heat transfer for the described scenario.
Boiling Heat Transfer of Impinging Jets on Superheated Superhydrophobic Surfaces
Superhydrophobic surfaces possess desirable self-cleaning properties, but have also been shown to reduce heat transfer to subcooled water in impinging jet scenarios. Further investigation is required to explore the potential utility of such surfaces in high temperature applications such as rocket launch-pad cooling. Here, superheated silicon substrates with varying wettability are quenched by an impinging water jet, where the substrate temperature is above the boiling regime which has previously been unexplored. Silicon wafers are etched, coated, and integrated with an electric resistance heater and heated to temperatures up to 300 ° C before being quenched by an axisymmetric water jet. The early results of this study confirm previous conjecture that decreased surface wettability is correlated to decreased heat transfer for the described scenario.
Comments
Poster Session